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Technology 

Hunter Technology Corporation
Interconnect and Electronic Manufacturing Services since 1968
Phone (408) 245-5400                2921 Corvin Drive

Fax (408) 245-5503               Santa Clara CA, 95051                
www.hunterpcb.com
Fabrication Technical Road Map

2008

Q4 2008

Q2 2009

2010

 

 

 

 

Current

Advanced

Future

Future
Drilling Aspect Ratio - Drilled Hole Size

7:01

10:01

12:01

> 15 : 1
Holes <= 10 mil
Laser Drilled Blind Via Aspect Ratio 0.5:1 0.7:1 1:1 1:1
Min. Drilled Hole Size (vias) 0.010 0.008 0.006 0.006
Min. Finished Hole Size (vias) 0.004 0.0035 0.003 0.003
Min. Outer Layer Via Land Size 0.020 0.018 0.016 0.016
Min. Inner Layer Via Land Size 0.018 0.016 0.014 0.014
Min. Via Relief on Power/Ground Planes 0.028 0.026 0.024 0.024
Min. Blind/Buried Via Land Size 0.016 0.014 0.012 0.012
Min. Blind/Buried Via Hole Size (Mech) Drilled) 0.008 0.006 0.005 0.005
Min. Laser Drilled Microvia 0.004 0.004 0.003 0.003
Min. Outer Layer Line Width 0.004 0.003 0.0025 0.0025
Min. Inner Layer Line Width 0.004 0.003 0.0025 0.0025
Min. Outer Layer Line to Line Spacing 0.004 0.003 0.0025 0.0025
Min. Inner Layer Line to Line Spacing 0.004 0.003 0.0025 0.0025
Min. Line to Via Land Spacing 0.004 0.003 0.0025 0.0025
Layer to Layer Registration Tolerance: plus/minus 0.005 0.004 0.003 0.003
Min. Component Pitch .75mm .65mm .5mm .4mm
Max. Overall Board Thickness 0.200 0.250 0.250 0.300
Min. Core Dielectric Thickness 0.003 0.003 0.002 0.002
Min. Prepreg Dielectric Thickness 0.0025 0.002 0.0018 0.0018
Minimum Solder mask Webbing 0.005 0.004 0.004 0.003
Line to SMT Minimum Space 0.004 0.0035 0.003 0.003
Min. Base Copper Weights 0.0007 0.00035 0.00017 0.00017
Layer Count 38 38+ 38+ 38+
Panel Size  (Hunter uses several different sizes) 18 x 24 18 x 24 18 x 24 18 x 24
Fabrication Radius 0.031 0.016 0.016 0.012
Warpage 0.75% 0.75% 0.75% 0.75%
Tolerance-Plated Holes  +/- 0.003 0.003 0.0025 0.002
Impedance Tolerance     +/- 10% +/- 5% +/- 5% +/- 5%
Stacked Copper Plated Vias     Yes Yes
Surface Finishes HASL,HASL (LEAD FREE), Fused Sn/Pb,Electrodeposited Ni/AU,Soft Bondable Gold,ENIG,White Tin and Immersion Silver
MATERIALS STANDARD OFFERINGS
All Rogers including  3,4,5,6000 X
Brass Back/Rogers X
BT X
FR-4 (FR406) (FR370HR) X
FR408,Nelco-13,-13 SI X
GETEK X
Low Er Epoxy X
Nelco 6000 X
Polyimide X
Teflon X
Thermount X
CIC X
Stablcor X
FAB TEST STANDARD ADVANCED
Electrical Test:                      Continuity (ohms) 20 5
Isolation (Mohms) 10 76
Voltage 100 250
Min Component Pitch 0.015 0.01
Impedance Testing:                    Range (ohms)  40-100 28-150
Tolerance  10% 5%
Differential (up to 175ohms)   yes
Equipment Universal and Flying Probe
DC resistance Testing 6.5 digit DMM