Hunter Technology's extensive PCB engineering experience can help compress the development cycle of your product, enhance performance, and reduce cost. We build at three facilities focused on: High Technology, Low to Mid Technology, and Military.

Fabrication Services
• Quick Turnaround; 24 Hours to 3 Days Based on Complexity
• Thermal Management Solutions
• Valor Genesis Design Rule Check (DRC)
• Gerber to CAD Netlist Comparison
• Prototype to Production Quantities and Virtual Manufacturing
• Net List Testing: Flying Probe and Bed of Nails
• TDR Testing for Impedance: Single Ended & Differential Pairs
• Engineering Support Services for Impedance Modeling, SI, and Fabrication
• Design Rules
• Layer Stack-Up and Special Materials Consulting
• Large Format Custom Backplanes
 

Capabilities
• 2 to 44 Layers
• Impedance Modeling and Layer Stack Up Generation
• Controlled Impedance: Zo, Zd and Rambus
• Trace Widths Down to 3 mils, Spacing Down to 3 mils
• Blind & Buried Vias and Microvias
• Materials: FR4, STABLCOR, Teflon, BI, BT, Polyimide, Duroid, Thermount,
   Rogers (All Materials),
• High Temp Epoxy, and Low Loss Epoxy (FR408, N4000-13 & -13SI, N6000SI)
• Composite Boards: High Speed Material (Teflon)/ FR4 Combined Materials
• Gold Body (Hard and Wire Bondable), Ni/Pd/Au, Entek, HASL Surface Finishes
• BGA, Micro BGA, COB, SMT, PTH, & Edge Plating
• Heatsinks, Metal Core, Cu/In/Cu, Cu/Mo/Cu
 
Quality
• ISO 9001 and 9002 Certified
• Mil-PRF-55110 G Certified
• UL Certified