|
Hunter Technology Corporation |
||||||||
| Interconnect and Electronic Manufacturing Services since 1968 | ||||||||
| Phone (408) 245-5400 2921 Corvin Drive | ||||||||
|
Fax (408) 245-5503 Santa Clara CA, 95051 |
||||||||
| Fabrication Technical Road Map |
2009 |
Q2 2009 |
Q4 2009 |
2010 |
|
|
|
|
|
Current |
Advanced |
Future |
Future |
|||||
| Drilling Aspect Ratio - Drilled Hole Size |
10:01 |
12:01 |
15:01 |
> 20 : 1 |
||||
| Laser Drilled Blind Via Aspect Ratio | 0.5:1 | 0.7:1 | 1:1 | 1:1 | ||||
| Min. Drilled Hole Size (vias) | 0.010 | 0.008 | 0.006 | 0.006 | ||||
| Min. Finished Hole Size (vias) | 0.004 | 0.0035 | 0.003 | 0.003 | ||||
| Min. Outer Layer Via Land Size | 0.020 | 0.018 | 0.016 | 0.016 | ||||
| Min. Inner Layer Via Land Size | 0.018 | 0.016 | 0.014 | 0.014 | ||||
| Min. Via Relief on Power/Ground Planes | 0.028 | 0.026 | 0.024 | 0.024 | ||||
| Min. Blind/Buried Via Land Size | 0.016 | 0.014 | 0.012 | 0.012 | ||||
| Min. Blind/Buried Via Hole Size (Mech) Drilled) | 0.008 | 0.006 | 0.005 | 0.005 | ||||
| Min. Laser Drilled Microvia | 0.004 | 0.004 | 0.003 | 0.003 | ||||
| Min. Outer Layer Line Width | 0.004 | 0.003 | 0.0025 | 0.0025 | ||||
| Min. Inner Layer Line Width | 0.004 | 0.003 | 0.0025 | 0.0025 | ||||
| Min. Outer Layer Line to Line Spacing | 0.004 | 0.003 | 0.0025 | 0.0025 | ||||
| Min. Inner Layer Line to Line Spacing | 0.004 | 0.003 | 0.0025 | 0.0025 | ||||
| Min. Line to Via Land Spacing | 0.004 | 0.003 | 0.0025 | 0.0025 | ||||
| Layer to Layer Registration Tolerance: plus/minus | 0.005 | 0.004 | 0.003 | 0.003 | ||||
| Min. Component Pitch | .75mm | .65mm | .5mm | .4mm | ||||
| Max. Overall Board Thickness | 0.200 | 0.250 | 0.250 | 0.300 | ||||
| Min. Core Dielectric Thickness | 0.003 | 0.003 | 0.002 | 0.002 | ||||
| Min. Prepreg Dielectric Thickness | 0.0025 | 0.002 | 0.0018 | 0.0018 | ||||
| Minimum Solder mask Webbing | 0.005 | 0.004 | 0.004 | 0.003 | ||||
| Line to SMT Minimum Space | 0.004 | 0.0035 | 0.003 | 0.003 | ||||
| Min. Base Copper Weights | 0.0007 | 0.00035 | 0.00017 | 0.00017 | ||||
| Layer Count | 38 | 38+ | 38+ | 38+ | ||||
| Panel Size (Hunter uses several different sizes) | 18 x 24 | 18 x 24 | 18 x 24 | 18 x 24 | ||||
| Fabrication Radius | 0.031 | 0.016 | 0.016 | 0.012 | ||||
| Warpage | 0.75% | 0.75% | 0.75% | 0.75% | ||||
| Tolerance-Plated Holes +/- | 0.003 | 0.003 | 0.0025 | 0.002 | ||||
| Impedance Tolerance +/- | 10% | +/- 5% | +/- 5% | +/- 5% | ||||
| Stacked Copper Plated Vias | Yes | Yes | ||||||
| Surface Finishes | HASL,HASL (LEAD FREE), Fused Sn/Pb,Electrodeposited Ni/AU,Soft Bondable Gold,ENIG,White Tin and Immersion Silver | |||||||
| MATERIALS | STANDARD OFFERINGS | |||||||
| All Rogers including 3,4,5,6000 | X | |||||||
| Brass Back/Rogers | X | |||||||
| BT | X | |||||||
| FR-4 (FR406) (FR370HR) | X | |||||||
| FR408,Nelco-13,-13 SI | X | |||||||
| GETEK | X | |||||||
| Low Er Epoxy | X | |||||||
| Nelco 6000 | X | |||||||
| Polyimide | X | |||||||
| Teflon | X | |||||||
| Thermount | X | |||||||
| CIC | X | |||||||
| Stablcor | X | |||||||
| FAB TEST | STANDARD | ADVANCED | ||||||
| Electrical Test: Continuity (ohms) | 20 | 5 | ||||||
| Isolation (Mohms) | 10 | 76 | ||||||
| Voltage | 100 | 250 | ||||||
| Min Component Pitch | 0.015 | 0.01 | ||||||
| Impedance Testing: Range (ohms) | 40-100 | 28-150 | ||||||
| Tolerance | 10% | 5% | ||||||
| Differential (up to 175ohms) | yes | |||||||
| Equipment | Universal and Flying Probe | |||||||
| DC resistance Testing | 6.5 digit DMM | |||||||
| Propagation Delay | 135 to 185 ps/inch Material and Zo Circuit type dependent | |||||||
| ASSEMBLY ATTRIBUTES | STANDARD | 2009 | ||||||
| µBGA, CSP, BGA attach to 45 mm max size | X | |||||||
| BGA assembly down to 0.5mm pitch | X | |||||||
| Connector and terminal press-fit capability | X | |||||||
| Design Review for Manufacturability | X | |||||||
| Double-side SMT + Thru-hole | X | |||||||
| Fine-pitch SMT, QFP down to 16 mil pitch | X | |||||||
| Flex Circuit Assembly | X | |||||||
| High-speed Pick & Place + Wavesolder | X | Selective Solder | ||||||
| Pick & Place 0201 components | X | 01005 | ||||||
| Prototyping and Small to Medium Volume Production Contract Manufacturing | X | |||||||
| Rework, Parts Recovery, Rebuild | X | |||||||
| Use of RMA and RA flux | X | |||||||
| RoHS and Standard Solder Build Processes | X | Hi volume Lead Free | ||||||
| Small Parts Assembly and Soldering | X | |||||||
| Water Soluble processes + Aqueous Cleaning | X | |||||||
| Consigned and Turnkey | X | |||||||
| ASSEMBLY TEST | STANDARD CAPABILITIES | |||||||
| Solder Paste volume measurement | X | |||||||
| AOI | X | |||||||
| Flying Probe Test | X | |||||||
| Functional Test | X | |||||||
| ICT | X | |||||||
| 2 Dimensional X-ray | X | |||||||
| X-ray Laminography (5DX) | X | |||||||
| J-Tag | X | |||||||
| DESIGN | STANDARD CAPABILITIES | |||||||
| Altium - Designer 6 | X | |||||||
| Altium - Summer 08 | X | |||||||
| Altium - Protel 99SE | X | |||||||
| Altium - P-CAD 2004-2006 | X | |||||||
| Cadence - Allegro PCB XL | X | |||||||
| Cadence - Concept HDL-XL | X | |||||||
| Cadence - Spectra Router XL | X | |||||||
| Cadence - Orcad-CIS | X | |||||||
| Cadence - OrCAD PCB Designer | X | |||||||
| CADSoft - Eagle PCB | X | |||||||
| CDS - Master PCB Designer - EPD | X | |||||||
| Mentor - Board Station | X | |||||||
| Mentor - Expedition | X | |||||||
| Mentor - RE Router | X | |||||||
| Mentor - PADs Layout 2007.2 | X | |||||||
| Mentor - DxDesigner | X | |||||||
| Mentor - PADs Logic 2007.2 | X | |||||||
| Mentor - Blaze Router | X | |||||||
| Zuken - Cadstar (sch/pcb/router) | X | |||||||
| Downstream - CAM350 | X | |||||||

